Latest resources from TE Connectivity
Presented at DesignCon 2009
When designing links, SI engineers often begin with a specific connector platform and then modify system variables such as trace length, dielectric...
KOAXXA SMA RF Interconnects Innovation & Tech...
This white paper presents a technical overview of TE Connectivity's (TE) new KOAXXA SMA RF interconnect product portfolio. Our KOAXXA SMA product e...
Solutions for Causal Modeling and A Technique...
This paper addresses specific dielectric and conductor material relationships necessary to produce consistently causal and accurate electrical comp...
