Processors
ENHANCED BOILING HEAT TRANSFER BY SUBMERGED ULTRASONIC VIBRATIONS
This paper describes a new two-phase cooling heat transfer cell based on a submerged vibration-induced...
Using Non-transparent Bridging in PCI Express Systems
PCI was originally designed as an interconnect for personal computers,because of the nature of PCs at...
PRACTICAL LOW POWER CPLD DESIGN
Any engineer involved with portable or handheld products knows that minimizing power consumption is an...
XMOS Technology Whitepaper
Designers for electronic products are challenged by requests for customized and differentiated complex...
XMOS Timing Analyzer Whitepaper
To guarantee the correct behavior of real-time software running on embedded processors can pose a significant...
Factorized Power Architecture and VI Chips
As electronic systems continue to trend toward lower voltages with higher currents and as the speed of...
ECC vs. Non-ECC MEMORY
Viking Technology manufactures DRAM modules for OEMs in Enterprise, Telecommunications and Industrial...
Pre-tested System-on-Chip Design Accelerates PLD Development
Many moderate size Programmable Logic Device (PLD) designs, especially those in control plane applications,...
Computer-on-Module: selecting the right form factor and processor
When it comes to Computer-on-Module (COM) solutions for embedded computing applications, selecting the...
Powering your FPGA Applications
Field-programmable gate arrays (FPGAs) have gained much attention and widespread application in the end...
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