Thermal Management Design Resources for Vicor ChiP Products
Two key factors in maximizing power converter performance and successful power system design are thermal environment and heat management. Power densities are increasing faster than power converter efficiency,thus increased performance from thermal management solutions is required.
Products based on Vicor's new ChiP packaging technology are optimized for both electrical and thermal performance.
Download this whitepaper for more information.
Read More
By submitting this form you agree to Vicor Corporation contacting you with marketing-related emails or by telephone. You may unsubscribe at any time. Vicor Corporation web sites and communications are subject to their Privacy Notice.
By requesting this resource you agree to our terms of use. All data is protected by our Privacy Notice. If you have any further questions please email dataprotection@techpublishhub.com
Related Categories: Components, cooling, Power, Power modules, Power semiconductors, Semiconductors
More resources from Vicor Corporation
Factorized Power Architecture and VI BRICKs
As electronic systems continue to trend toward lower voltages with higher currents and as the speed of contemporary loads continues to increase, th...
350V to12V DC “Yeaman Topology” Power System
This paper introduces a new DC/DC power supply architecture, called “Yeaman Topology”. The main characteristic of this topology is to separate ...
Thermal Management Design Resources for Vicor ChiP Products
Two key factors in maximizing power converter performance and successful power system design are thermal environment and heat management. Power den...
