Processors

Using Non-transparent Bridging in PCI Express Systems
PCI was originally designed as an interconnect for personal computers,because of the nature of PCs at...

SynJet: Low-Power “Green” Cooling
The realities of finite petroleum resources and growing global energy needs along with the confidence...

LGA80D Digital DC-DC Converter Module
The LGA80D from Artesyn Embedded Technologies is the first DC-DC converter module of its kind on the...

ENHANCED BOILING HEAT TRANSFER BY SUBMERGED ULTRASONIC VIBRATIONS
This paper describes a new two-phase cooling heat transfer cell based on a submerged vibration-induced...

Factorized Power Architecture and VI Chips
As electronic systems continue to trend toward lower voltages with higher currents and as the speed of...

XMOS Timing Analyzer Whitepaper
To guarantee the correct behavior of real-time software running on embedded processors can pose a significant...

USING LOW COST, NON-VOLATILE PLDS IN SYSTEM APPLICATIONS
System designers are faced with continual pressure to meet their development schedules, and need to implement...

Implementing Flexible USB Type-C Control Using FPGA Technology
Type-C interfaces bring dramatic benefits to consumers. However, in order to realize this potential designers...

Device Security for the IIoT
The Industrial Internet of Things (IIoT) is driving investment in new technology and manufacturing methodologies...

Computer-on-Module: selecting the right form factor and processor
When it comes to Computer-on-Module (COM) solutions for embedded computing applications, selecting the...

Ball vs. Sleeve: A Comparison In Bearing Performance
As consumers demand smaller, faster computer systems, OEM design engineers race to create systems with...

Reducing Cost and Power in Consumer Applications Using PLDs
The need to respond to changing market standards in a compressed time to market window has led to the...
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