Case Study on the Validation of SAC305 and SnCu Based Solders in SMT, Wave and Hand-soldering at the Contract Assembler Level
In recent years tin-copper based solders with a variety of elemental additives have emerged which improve the overall properties and performance of tin-copper solders.
This paper is a summary of the experience at a medium sized assembler in achieving the customer driven mandate to go lead-free and the maintenance of production yields and quality using both tin-silver-copper and tin-copper in the assembly of high end printer boards. Over 120,000 builds were achieved with A 99.6% first pass yield for the overall soldering process.
Download this whitepaper to learn more.
Read More
By submitting this form you agree to Kester Inc contacting you with marketing-related emails or by telephone. You may unsubscribe at any time. Kester Inc web sites and communications are subject to their Privacy Notice.
By requesting this resource you agree to our terms of use. All data is protected by our Privacy Notice. If you have any further questions please email dataprotection@techpublishhub.com
Related Categories: Components, Connectors
More resources from Kester Inc
THE NATURE OF WHITE RESIDUE ON PRINTED CIRCUIT ASSEMBLIES
White residue remaining after cleaning circuit board assemblies can be caused by a variety of chemicals and reactions. Rosin and water-soluble flux...
How do you create a RoHS Compliancy-Lead-free Roadmap?
When a company begins the transition to lead-free it impacts the whole organization. The cost of transition will vary and depends on the number of ...
Lead-free Reliability - Building it right the First Time
As lead-free and RoHS compliancy fast approaches, it is more important than ever to build it right the first time. Leadfree assembly and RoHS will ...